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| HMC247 v01.1007 400 ANALOG PHASE SHIFTER 5 - 18 GHz Typical Applications The HMC247 is ideal for: * Fiber Optics Features Wide Bandwidth: 5 - 18 GHz Phase Shift: >400 Single Positive Voltage Control Small Size: 2.3 x 1.6 x 0.1 mm 3 PHASE SHIFTERS - CHIP * Military * Test Equipment Functional Diagram General Description The HMC247 is an Analog Phase Shifter die which is controlled via an analog control voltage from 0 to +10V. The HMC247 provides a continuously variable phase shift of 0 to 300 degrees at 9 GHz, and 0 to 100 degrees at 18 GHz, with consistent insertion loss versus phase shift. The phase shift is monotonic with respect to the control voltage. The control port has a modulation bandwidth of 50 MHz. The low insertion loss and compact size enable this part to be used in a wide range of applications, including the phase adjustment of clocks in fiber optic systems and test equipment. All data is measured with the chip in a 50 ohm test fixture, connected via 0.076 mm (3 mil) ribbon bonds of minimal length <0.31 mm (<12 mils). Electrical Specifi cations, TA = +25 C, 50 Ohm System Parameter Phase Shift Range: Frequency (GHz) 5 - 10 GHz 10 - 13 GHz 13 - 18 GHz 5 - 10 GHz 10 - 18 GHz 5 - 18 GHz 5 - 18 GHz 5 - 18 GHz 5 - 18 GHz 5 - 18 GHz Min. 180 135 45 Typ. 400 200 120 8 4 8 0 - 10 50 40 0.5 12 7 Max. Units degrees degrees degrees dB dB dB Volt MHz deg /Volt deg /C Insertion Loss Return Loss (Input and Output) Control Voltage Range Modulation Bandwidth Phase Voltage Sensitivity Insertion Phase Temperature Sensitivity 3-2 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC247 v01.1007 400 ANALOG PHASE SHIFTER 5 - 18 GHz Insertion Loss vs. Control Voltage @ 12 GHz 0 Phase Shift vs. Control Voltage NORMALIZED PHASE SHIFT (degrees) 500 6 GHz 12 GHz 18 GHz INSERTION LOSS (dB) -2 400 -4 +25C +85C -55C 300 3 PHASE SHIFTERS - CHIP 3-3 -6 200 -8 100 -10 0 1 2 3 4 5 Vctl (V) 6 7 8 9 10 0 0 1 2 3 4 5 Vctl (V) 6 7 8 9 10 Phase Shift vs. Frequency @ Vctl = 10V (Relative to Vctl = 0V) NORMALIZED PHASE SHIFT (degrees) 600 500 400 300 200 100 0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz) +25C +85C -55C Insertion Loss vs. Frequency 0 -2 INSERTION LOSS (dB) -4 -6 -8 -10 -12 -14 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz) 0V 2V 4V 6V 8V 10V Input Return Loss vs. Frequency, Vctl = 0 to +10V 0 Output Return Loss vs. Frequency, Vctl = 0 to +10V 0 RETURN LOSS (dB) -10 RETURN LOSS (dB) 5 6 7 8 9 10 11 12 13 14 15 16 17 18 -5 -5 -10 -15 -15 -20 FREQUENCY (GHz) -20 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC247 v01.1007 400 ANALOG PHASE SHIFTER 5 - 18 GHz Second Harmonics vs. Control Voltage, Pin = -10 dBm 100 Input IP3 vs. Control Voltage 35 30 2nd HARMONICS (dBc) 60 IP3 (dBm) 3 PHASE SHIFTERS - CHIP 80 25 6 GHz 12 GHz 18 GHz 20 15 10 40 6 GHz 12 GHz 18 GHz 20 5 0 0 1 2 3 4 5 Vctl (V) 6 7 8 9 10 0 0 2 4 Vctl (V) 6 8 10 Insertion Loss vs. Pin @ 7 GHz 0 0V 5V 10V Insertion Loss vs. Pin @ 12 GHz 0 INSERTION LOSS (dB) -4 INSERTION LOSS (dB) -2 -2 -4 0V 5V 10V -6 -6 -8 -8 -10 -15 -10 -5 0 5 10 15 20 25 -10 -15 -10 -5 0 5 10 15 20 25 INPUT POWER (dBm) INPUT POWER (dBm) Insertion Loss vs. Pin @ 18 GHz 0 Phase Shift vs. Pin @ 7 GHz NORMALIZED PHASE SHIFT (degrees) 5 0V 5V 10V INSERTION LOSS (dB) -2 3 -4 0V 5V 10V 1 -6 -1 -8 -3 -10 -15 -10 -5 0 5 10 15 20 25 -5 -10 -5 0 5 INPUT POWER (dBm) INPUT POWER (dBm) 3-4 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC247 v01.1007 400 ANALOG PHASE SHIFTER 5 - 18 GHz Phase Shift vs. Pin @ 18 GHz NORMALIZED PHASE SHIFT (degrees) 0.5 0V 5V 10V Phase Shift vs. Pin @ 12 GHz NORMALIZED PHASE SHIFT (degrees) 0.5 0V 5V 10V 0.3 0.3 0.1 0.1 3 0 5 -0.1 -0.1 -0.3 -0.3 -0.5 -10 -5 0 5 -0.5 -10 -5 INPUT POWER (dBm) INPUT POWER (dBm) Absolute Maximum Ratings Control Voltage (Vctl) Reverse Current Input Power (RFin) Channel Temperature (Tc) Continuous Pdiss (T = 85 C) (derate 28 mW/C above 85 C) Thermal Resistance (junction to die bottom) Storage Temperature Operating Temperature +11 Vdc 5 mA +30 dBm 150 C 1.83 W 35.6 C/W -65 to +150 C -55 to +85 C For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3-5 PHASE SHIFTERS - CHIP HMC247 v01.1007 400 ANALOG PHASE SHIFTER 5 - 18 GHz Assembly Diagram 3 PHASE SHIFTERS - CHIP Pad Descriptions Pad Number 1, 2 Function RFIN Description Port is DC blocked. Interface Schematic 3 Vctl Phase shift control pin. Application of voltage between 0 and 10 volts causes the transmission phase to change. The DC equivalent circuit is a series connected diode resistor 4, 5 RFOUT Port is DC blocked. GND The backside of the die must be connected to RF / DC ground. 3-6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC247 v01.1007 400 ANALOG PHASE SHIFTER 5 - 18 GHz Outline Drawing 3 PHASE SHIFTERS - CHIP 3-7 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. TIE ALL UNLABLED BOND PADS TO GROUND. 3. DIE THICKNESS IS .004" 4. TYPICAL BOND PAD IS .004" SQUARE. 5. BACKSIDE METALIZATION: GOLD. 6. BOND PAD METALIZATION: GOLD. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and fl at. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com |
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